ligitek electronics co.,ltd. property of ligitek only pb lead-free parts LURF3833S-PF super bright round type led lamps data sheet doc. no : qw0905-LURF3833S-PF rev. : a date : 02 - feb. - 2008
page 1/5 ligitek electronics co.,ltd. property of ligitek only 5.0 5.6 1.5max 7.7 8.7 package dimensions part no. LURF3833S-PF 1.0min + - 2.54typ 30 -30 0 50% 25%75% 50% 75%25% 0 100% 60 100% -60 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 0.5 typ 25.0min
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) algainp material LURF3833S-PF part no red water clear color emitted lens spectral halfwidth nm forward voltage @20ma(v) viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length dnm 2.6 1.7 20 625 max. 2100012 11500 typ. min. t opr operating temperature storage temperature tstg peak forward current duty 1/10@10khz reverse current @5v power dissipation forward current ir pd i fp i f -40 ~ +85 -40 ~ +100 10 120 90 50 a mw ma ma absolute maximum ratings at ta=25 parameter symbol page 2/5 ratings urf(s) unit ligitek electronics co.,ltd. property of ligitek only min. static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * electrostatic discharge( * ) esd2000v part no. LURF3833S-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 luminous intensity vs. temperature ambient temperature( ) l u m i n o u s i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) l u m i n o u s i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 0 0 50 100 150 050100150 0.0 1.0 2.0 3.0 -40-200204060 0.51.01.52.0 80100 0.94 -20 -4040 20 080100 60 0.8 0.0 0.2 0.4 0.6 1.0 1.2 urfs chip page 3/5 fig.2 luminous intensity vs. forward current 5.0 4.0 6.0 2.53.0 0.96 0.98 1.00 1.02 1.04 1.06 0 550600650700 0.5 1.0 part no. LURF3833S-PF
ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) page 4/5 temp( c) 260 5 /sec max 260 c3sec max 100 150 time(sec) 2 /sec max 120 25 50 preheat 60 seconds max 0 0 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LURF3833S-PF
reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 5/5 page description test itemtest condition reliability test: operating life test low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs thermal shock test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. part no. LURF3833S-PF
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